The thickness of the silicon wafer is required to be measured

       Since the silicon wafer is an opaque and reflective item, this test adopts D40A36 with dual-channel H4UC controller. D40A36 has a small spot, higher resolution and measurement accuracy, which is very suitable for measuring high-precision, high-resolution and reflective items.

(thickness on the opposite side)

     The blue curve is the height data curve of the upper lens, and the red curve is the height data curve of the lower lens. The thickness curve can be calculated by the height value of the upper and lower lenses.

(Thickness of silicon wafer)

In this measurement, the upper and lower lens height of the sample is measured numerically, and the thickness value is calculated. Product warping can be determined by three sets of values. For semi-transparent semiconductor chip measurement products, dual-band controller can be used for beam scanning.