Glue break measurement
Detection requirements: To measure whether the glue in the sample gap is broken, the vertical instrument spectral confocal controller is used in this test, and the sensor D35A30R4 is used. The product is placed horizontally on the scanning platform of the profiler, and the product surface is scanned by the profiler. Apply glue to the area to be detected (as shown above), set the relevant parameters on the contour scan, and scan (as shown below), and then the data we want will appear. Lii Technology is a company specializing in the production and development of spectral confocal displacement sensors, laser displacement sensors, white light interferometers, film thickness meters, products are widely used in 3C, semiconductor aerospace and other high-precision detection.